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DIVIDEND ANNOUNCEMENT: High Yield Bond & Alternative Credit ETF/SEI Exchange Traded Fund (NASDAQ:LEND) on 07/02/2026 declared a dividend of $0.2450 per share
High Yield Bond & Alternative Credit ETF/SEI Exchange Traded Fund (NASDAQ:LEND) on 07/02/2026 declared a dividend of $ 0.2450 per share payable on July 07, 2026 to shareholders of record as of July 06, 2026. Dividend amount recorded is an increase of $ 0.245 from last dividend Paid.
High Yield Bond & Alternative Credit ETF/SEI Exchange Traded Fund (NASDAQ:LEND) has paid dividends since 2026, has a current dividend yield of 11.6805725098% and has increased its dividends for 0 successive years.
The stock price closed yesterday at $ 25.17 and has a 52 week low/high of $ 24.96 and $ 25.29.
For more information on High Yield Bond & Alternative Credit ETF/SEI Exchange Traded Fund click here.
Dividend Ex Date: July 06, 2026
Dividend Record Date: July 06, 2026
Dividend Payment Date: July 07, 2026
Dividend Amount: $ 0.2450
LEND LINKS
LEND Dividend History Detail
LEND Projected 10 Year Dividend Yield
LEND Dividend News
LEND Competitors News
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