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DIVIDEND ANNOUNCEMENT: High Yield Bond & Alternative Credit ETF/SEI Exchange Traded Fund (NASDAQ:LEND) on 09/02/2026 declared a dividend of $0.1206 per share
High Yield Bond & Alternative Credit ETF/SEI Exchange Traded Fund (NASDAQ:LEND) on 09/02/2026 declared a dividend of $ 0.1206 per share payable on September 04, 2026 to shareholders of record as of September 03, 2026. Dividend amount recorded is a decrease of $ 0.0206 from last dividend Paid.
High Yield Bond & Alternative Credit ETF/SEI Exchange Traded Fund (NASDAQ:LEND) has paid dividends since 2026, has a current dividend yield of 8.1639547348% and has increased its dividends for 0 successive years.
The stock price closed yesterday at $ 24.87 and has a 52 week low/high of $ 24.79 and $ 25.29.
For more information on High Yield Bond & Alternative Credit ETF/SEI Exchange Traded Fund click here.
Dividend Ex Date: September 03, 2026
Dividend Record Date: September 03, 2026
Dividend Payment Date: September 04, 2026
Dividend Amount: $ 0.1206
LEND LINKS
LEND Dividend History Detail
LEND Projected 10 Year Dividend Yield
LEND Dividend News
LEND Competitors News
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